Manufacturer
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62 entries
The ULVAC UNECS-2000 is a spectroscopic ellipsometer used to measure refractive index and thin-film thickness.
The Ulvac NE 5500 is an etch tool used in semiconductor manufacturing.
The Ulvac CME 200 J is a plasma-enhanced chemical vapor deposition (PECVD) system.
The Ulvac EBX 2000 is a high vacuum evaporation system manufactured by Ulvac, with a reported vintage of 2005.
The Ulvac EX 550 C 12 Vapor is a vapor deposition system that accepts 6-inch wafers.
The Ulvac PDR 090 B is a dry pump.
The Ulvac SIV 200 ITO is a sputtering system.
The Ulvac EBX 1000 C is a vapor deposition tool for 6-inch wafers.
The Ulvac SME 200 J is a sputtering system.
The Ulvac SIV 500 ITO is a sputtering system.
The Ulvac NE 550 EX is a dry etcher that handles 4 inch wafers.
The Ulvac CRYO U 8 HL is a cryopump with a 9.5-inch outer diameter and an 8.375-inch inner diameter ISO flange.
The Ulvac CV 200 is a physical vapor deposition (PVD) sputter system.
The Ulvac NE 700 Dry is a dry etcher manufactured by Ulvac and categorized as an Etch tool.
The Ulvac Heliot 700 Helium Leak Detector is a helium leak detector manufactured by ULVAC of Japan.
The Ulvac SOPHI 200 Ion is an ion implantation tool family entry with one documented model, SOPHI 200 Ion.
The Ulvac U 12 Cryopump is a cryopump identified by model U 12.
The Ulvac Enviro Advanced Strip is an equipment model from Ulvac for which no technical specifications are publicly documented.
The Ulvac SME 200 Pt Platinum is a sputter deposition system.
The Ulvac U 22 is a cryopump.
The Ulvac U 9 Cryopump is a cryopump manufactured by Ulvac.
The Ulvac LR 3600 Dry is a dry pump manufactured by Ulvac.
The Ulvac Ceraus ZX 1000 is a PVD (Physical Vapor Deposition) system that handles 8 inch wafers.
The Ulvac 1200 IIS is a semiconductor manufacturing tool by Ulvac, documented in equipment inventory listings.
The Ulvac NE 950 EX ICP is an inductively coupled plasma etcher.
The Ulvac SME 200 is a sputtering system used for thin film deposition.
The Ulvac Enviro Downstream Microwave Asher is a single-chamber advanced strip system with an ENI OEM-6B RF generator, five MFCs, a Brooks robot, and an Edwards IQ pump/blower.
The Ulvac Ei 7 L is an e-beam evaporator with an auto loader, wafer transfer system, load lock chamber, process chamber, and operation panel, designed for depositing metals such as Al, Ni, Ti, Pt, and Au.
The Ulvac SIV 500 is an in-line sputtering system used for thin-film deposition, including indium tin oxide (ITO).
The Ulvac Ceraus Z 1101 is a physical vapor deposition (PVD) system that processes 6 inch wafers.
The Ulvac NE 950 is an ICP-RIE etch system with a chamber described for 2" to 12" wafers.
The Ulvac SMD 450 is a sputtering system in the deposition category.
The Ulvac RFS 2780 is an RF generator.
The Ulvac Entron EX W 300 is a PVD (Physical Vapor Deposition) system manufactured by Ulvac.
The Ulvac NE 5700 is a dry etching system for production use, configured as a 200mm cluster tool with up to two process chambers.
The Ulvac Heliot 701 is a helium leak detector.
The Ulvac EBX 1000 is a high vacuum evaporation system.
The Ulvac NE 5000 N is an etcher described with 6-inch wafer size, helium cooling, auto loading and unloading, and uniformity of +/- 3%.
The Ulvac G 50 D is a two-stage rotary vacuum pump rated for 50/60 Hz.
The Ulvac NE-550 is a multipurpose high-density, low-pressure plasma etching system used for chlorine etching.