Ulvac
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The Ulvac CME 200 J is a plasma-enhanced chemical vapor deposition (PECVD) system.[1]
In plasma-enhanced chemical vapor deposition, precursor gases are introduced into a vacuum chamber where radio-frequency energy creates a plasma. The plasma dissociates the gases into reactive species that adsorb onto the substrate surface and form a solid film, while volatile byproducts are pumped away. The plasma lowers the thermal budget required for film formation, allowing deposition on wafers that have already received metallization or other temperature-sensitive layers.
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The following facts about the CME 200 J are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the CME 200 J are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CME 200 J are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CME 200 J are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CME 200 J are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CME 200 J are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 29, 2026.
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