Strasbaugh
7 AF Wafer
Plate 01Strasbaugh 7AF Video
Axus TechnologyWatch on YouTube
What it is
How it works
The system uses linear traversing grind spindles and force adaptive grinding to control material removal.[2][3]
In-situ thickness control provides real-time monitoring of wafer thickness during the grinding process.[2][3]
The grinder supports automated process control and thin wafer handling for processing wafers that have been thinned.[2][3]
Where it fits in the process flow
General reference — not yet source-verifiedWafer grinding is performed after the front-end-of-line (FEOL) and back-end-of-line (BEOL) processing steps are complete, and before wafer dicing.
The process reduces the wafer thickness to enable stacking in multi-chip packages and to improve heat dissipation.
Applications
General reference — not yet source-verifiedThe machine is applicable in the production of memory, logic, and other integrated circuits that require wafer thinning.
What do the numbers mean?
Power & electrical10
- No power supply[1]
Vacuum & pumping3
- Vacuum[1]
Wafer handling12
Control & software2
Dimensions & facilities2
- CDA[1]
Configuration & options27
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Why is wafer grinding performed before dicing in many flows?General reference — not yet source-verified
Grinding is used to thin the wafer and improve its suitability for later singulation and assembly steps.
What is the main process concern for this equipment class?General reference — not yet source-verified
The main concern is controlled material removal with accurate alignment so the wafer is processed without introducing unacceptable damage.
Not publicly documented
The following facts about the 7 AF Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7 AF Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7 AF Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7 AF Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7 AF Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7 AF Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
Last updated Sep 30, 2026.
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