Waferpedia

Comparison ledger

18 D Surfaceversus7 AF Wafer

Blanchard 18 D Surface, Strasbaugh 7 AF Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
7 AF WaferStrasbaugh
OEMBlanchardStrasbaugh
CategoryDicing & GrindingDicing & Grinding
Wafer size—Wafer handler
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceStrasbaugh 7 AF Wafer
Specifications
Voltage416 V[1]230 V[4]
Phase3 Phase[1]3 Phase[4]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]208 V, 3 phase, 60 Hz[3]
Date of Audit—9/12/25[3]
Configuration—Can produce wafers as-is[3]
Wafer size—Wafer handler[3]
Robot Type—Genmark[3]
SystemSW (App) Version—7.25.0[3]
Frequency—60 Hz[4]
Full Load Amp—45 A[4]
Equipment type—Wafer grinder[3]
Tapeless backgrinding—Listed[4]
In-feed technology—Listed[4]
In-situ thickness control—Listed[4]
Force adaptive grinding—Listed[4]
Linear traversing grind spindles—Listed[4]
Automated process control—Listed[4]
Thin wafer handling—Listed[4]
Wafer handler—Listed[3]
Cassette / FOUP loaders—2[3]
Pre-aligner—Listed[3]
Mini environment—Listed[3]
SystemSW version—7.25.0[3]
GEM / SECS—Listed[3]
Ethernet—Listed[3]
Heat exchange / chiller—Listed[3]
CDA—Listed[3]
DIW—Listed[3]
Vacuum—Listed[3]
Full load amp—20 A[5]
No field modifications—Listed[3]
No power supply—Listed[3]
No external transformer—Listed[3]
No UPS—Listed[3]
No corrosion visible on modules—Listed[3]
No backing pumps—Listed[3]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing