Lapmaster
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The Lapmaster 15 is a bench-mounted lapping and polishing machine.[4]
The machine is a "ring lapper" configuration, designed to achieve high standards of flatness and surface finish.[4]
The Lapmaster 15 is derived from the Lapmaster 12 and features a scaled-up lapping plate, conditioning rings, and a "wrap-around" worktable.[4]
Three conditioning rings provide in-process lap plate flatness control, and they locate in yoke/roller bearing assemblies.[4]
Workpieces are placed within carriers or fixtures that run inside the conditioning rings, or large cylindrical parts can be substituted for the rings themselves.[4]
The machine has a rigid, lightweight cast aluminum base.[4]
Standard specifications include a plate diameter of 15 inches (381 mm), three conditioning rings with an inner diameter of 5.5 inches (140 mm), and a standard spindle speed of 60 RPM with a variable speed drive range of 0-60 RPM.[4]
The lapping drive motor is rated at 0.5 HP (0.37 kW), and the polishing drive motor is rated at 0.75 HP (0.56 kW).[4]
The machine measures 25 inches (635 mm) in length, 20 inches (508 mm) in width, and 24 inches (610 mm) in height, with an estimated shipping weight of 285 lbs (129.3 kg).[4]
In semiconductor and precision manufacturing, lapping and polishing machines like the Lapmaster 15 are used after initial wafer slicing or grinding to remove surface damage and achieve the required flatness and surface finish.
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The plate diameter is 15 inches (381 mm).[4]
The Lapmaster 15 has three conditioning rings, each with an inner diameter of 5.5 inches (140 mm).[4]
The standard spindle speed is 60 RPM, with a variable speed drive range of 0-60 RPM.[4]
The machine measures 25 inches (635 mm) in length, 20 inches (508 mm) in width, and 24 inches (610 mm) in height. The estimated shipping weight is 285 lbs (129.3 kg).[4]
Typical components include valve bodies, discs, gears, vanes, valve plates, and shaft seals.[4]
The input power for the Lapmaster 15 is 110 Vac.[3]
The following facts about the 15 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 15 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 15 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 15 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 15 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 15 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
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The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
Disco 321 is a wafer dicing saw designed for dicing semiconductor wafers.