Nordson
March AP 300
The March AP 300 is a plasma system with a 300 Watt, 13.56 MHz RF generator and an integrated RF automated tuning network. The March AP 300 supports two gas sources plumbed into the system and includes built-in MFCs and a vacuum pump.[1][2]
What it is
The Nordson March AP 300 is an etch-class plasma system.[2]
The AP 300 includes a 300 Watt, 13.56 MHz RF generator, an integrated RF automated tuning network, built-in MFCs, a vacuum pump, advanced PLC controllers, a touch screen GUI software interface, two gas sources that can be plumbed into the system, a full system safety enclosure, and power and ground shelves.[1][2]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedPlasma etch tools sit in the pattern-transfer portion of semiconductor processing, where they remove selected material after a masking step defines the areas to be changed.
Applications
General reference — not yet source-verifiedPlasma etch systems are used for controlled material removal on semiconductor-related surfaces.
What do the numbers mean?
Power & electrical7
Vacuum & pumping2
- Vacuum pump[1]
Gas & chemistry2
- 2 gas sources can be plumbed into system[1]
Control & software3
Configuration & options9
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- SPTS CPX Pegasus— Same function class: Etch, nullCompare in depthsource[2]
- Lam Research TCP 9600 SE Metal— Same function class: Etch, nullCompare in depthsource[2]
- Lam Research 4520 Oxide— Same function class: Etch, nullCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration100-240 V[1]
- Configuration50/60 Hz[1]
- Configuration300 Watt, 13.56 MHz RF Generator[1]
- ConfigurationIntegrated RF Automated Tuning Network[1]
- Configuration2 gas sources can be plumbed into system[1]
- ConfigurationVacuum pump[1]
- Power100-240 V, 50/60 Hz, 1 Phase, 2 kVA[1]
- RF Generator300 Watt, 13.56 MHz[1]
- Gas delivery2 gas sources can be plumbed into system[1]
- Vacuum pumpVacuum pump included[1]
- Automated tuningIntegrated RF Automated Tuning Network[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the March AP 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the March AP 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the March AP 300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the March AP 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the March AP 300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the March AP 300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]March AP 300 — Nordson | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
Compare with similar tools
View all →
The Lam Research 4520 Oxide Etch is a single-wafer, vacuum load-locked low-pressure plasma etch system designed for oxide etching, including contact etch and planarization, for wafers up to 200 mm.
The SPTS / STS CPX Pegasus is an etcher with 8-inch wafer support and a two-chamber configuration.
The Lam TCP 9600 SE Metal Etch is a plasma etch system for metal layers on 6-inch and 8-inch wafers.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.