Lam Research
TCP 9600 SE Metal
The Lam TCP 9600 SE Metal Etch is a metal etcher that uses a transformer-coupled plasma (TCP) coil. The Lam TCP 9600 SE Metal Etch processes 6-inch and 8-inch wafers. The Lam TCP 9600 SE Metal Etch features backside helium cooling and an electrostatic chuck (ESC).[1]
What it is
General reference — not yet source-verifiedThe Lam Research TCP 9600 SE Metal Etch is a plasma etch system designed for metal layer etching in semiconductor manufacturing.
How it works
General reference — not yet source-verifiedTCP etchers use an inductively coupled plasma source, where a radio-frequency current is applied to a coil external to the chamber, generating a high-density plasma. The plasma is used to etch metal layers with high anisotropy and selectivity.
Where it fits in the process flow
General reference — not yet source-verifiedIn the semiconductor fabrication process, metal etch tools pattern the metal interconnect layers after deposition and lithography. The etched features subsequently undergo cleaning and barrier and seed deposition.
Applications
General reference — not yet source-verifiedThe primary application of metal etch is patterning aluminum and other metal films in back-end-of-line interconnect structures. The tool can also be used for etching metal stacks in memory and logic devices.
What do the numbers mean?
Power & electrical8
- On-Board RF Generators[1]
Vacuum & pumping3
- Heated Pumping Manifolds[1]
Wafer handling7
- Hine 38A Indexers[1]
Gas & chemistry7
Control & software5
- SECS Interface[1]
Configuration & options41
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Nordson March AP 1000— Same function class: Etch, nullCompare in depthsource[8]
- Nordson March AP 300— Same function class: Etch, nullCompare in depthsource[9]
- Oxford Instruments Plasmalab 100 ICP 380— Same function class: Etch, nullCompare in depthsource[10]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Electrical Requirements208V/80A[1]
- ConfigurationStandard Gas Panel[1]
- ConfigurationOrbitally Welded Gas Box[1]
- Helium Cooling MFC TypeUNIT UPC8130[1]
- ConfigurationHeated Pumping Manifolds[1]
- ConfigurationOn-Board RF Generators[1]
- Voltage208 V[6]
- Gas BoxOrbitally Welded Gas Box[1]
- Heated Pumping ManifoldsYes[1]
- On-Board RF GeneratorsYes[1]
- Chiller Electrical Requirements200/208VAC / 25A[1]
- Electrical Requirements200/208VAC / 25A[1]
- Gas PanelStandard[1]
- Gas BoxOrbitally Welded[1]
- Heated Pumping ManifoldsPresent[1]
- RF GeneratorsOn-Board[1]
- Additional Electrical (208 V variant)208 V[6]
- Gas panelStandard Gas Panel[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Lam TCP 9600 SE Metal Etch support?
The Lam TCP 9600 SE Metal Etch supports 6-inch and 8-inch wafer sizes.[7][6][11][1]
What is the electrical requirement for the TCP 9600 SE Metal Etch?
The electrical requirement for the mainframe is 208V/80A, and the chiller requires 200/208VAC/25A.[1]
What software and interface does the system use?
The system uses Lam Envision software, version E 1.5.2, and has a SECS interface.[1]
What type of wafer clamp mechanism is included?
The system uses an electrostatic chuck (ESC) with a polyamid ESC type.[1]
How is endpoint detection performed?
Endpoint detection is performed using monochromators, with an endpoint Lam PN of 830-330546-001.[1]
Not publicly documented
The following facts about the TCP 9600 SE Metal are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TCP 9600 SE Metal are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TCP 9600 SE Metal are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TCP 9600 SE Metal are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TCP 9600 SE Metal are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TCP 9600 SE Metal is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (11)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Equipment inventory listing
- [8]Equipment inventory listing
- [9]waferpedia.comwaferpedia.com
- [10]Equipment inventory listing
- [11]Equipment inventory listing
Last updated Oct 2, 2026.
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The Nordson March AP 1000 is a plasma system used for etching, operating at 50 Hz with a CB current of 25 A and an SCCR of 10 kA.
The Nordson March AP 300 is a plasma system with a 300 Watt, 13.56 MHz RF generator and an integrated RF automated tuning network assembly.
The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.