Esec 2100 hS

The Esec 2100 hS is a die bonder from Besi. The Esec 2100 hS is the third generation of the 300 mm high-speed die-bonding platform. The Esec 2100 hS is designed for epoxy die attach applications.^[1]

Die bonders pick individual dies from a wafer and place them onto a substrate or leadframe with adhesive. The Esec 2100 hS uses a pick-and-place structure called the Phi-Y concept, which combines rotational and linear movements to shorten the pick-and-place cycle. The Esec 2100 hS employs a light-and-rigid pick-and-place structure with advanced trajectory control. The Esec 2100 hS includes a liquid cooling system to maintain accuracy at high speed. The Esec 2100 hS provides real-time process monitoring through four live images of the process zones. The Esec 2100 hS offers constant status control with a real-time wafer, strip, and magazine viewer.^[1]

The Esec 2100 hS achieves a placement accuracy down to 20 micrometers at three sigma, with a high-accuracy mode option of 15 micrometers. The Esec 2100 hS supports a cycle time of 120 milliseconds with the liquid cooling option. The Esec 2100 hS can process wafer sizes from four inches to twelve inches on eight-inch or twelve-inch wafer frames. The Esec 2100 hS handles die sizes from 0.25 millimeters (with the small die kit) to 20 millimeters. The Esec 2100 hS accommodates leadframe lengths from 90 to 300 millimeters and widths from 23 to 100 millimeters.^[1]

The Esec 2100 hS is used for an extensive range of epoxy die attach applications. The Esec 2100 hS is capable of running packages such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA. The Esec 2100 hS supports multiple bonding processes including epoxy, soldering, thermo-compression, and eutectic bonding. The Esec 2100 hS has variants for soft solder die bonding and flip-chip bonding (Esec 2100 SSI and Esec 2100 FC hS).^[1]