Esec
2009 fS E
The Esec 2009 fS E is a die bonder for epoxy die attach applications. The Esec 2009 fS E is a 3rd generation 300 mm high-speed platform. The Esec 2009 fS E supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
General reference — not yet source-verifiedThe Esec 2009 fS E is a die bonder used in semiconductor packaging and assembly.
Die bonders place singulated semiconductor die onto substrate or leadframe packages, typically using an adhesive or solder bonding method.
How it works
The machine can handle wafer sizes from 4 to 12 inches and supports die sizes from 0.25 mm to 20 mm, with placement accuracy down to 15 or 20 µm at 3 sigma depending on the configuration.[1]
A cycle time of 120 ms is achievable with the liquid cooling option.[1]
The system uses real-time process monitoring through four live images of the process zone and includes a constant status viewer for wafer, strip, and magazine status.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe Esec 2009 fS E is used in the die bonding step of semiconductor packaging, which is performed after wafer dicing and before wire bonding or other interconnect processes.
The machine processes substrates or leadframe strips that are typically fed from a magazine input or a substrate handler.
Applications
General reference — not yet source-verifiedThe Esec 2009 fS E is a soft solder die bonder, used for attaching semiconductor die using solder-based bonding methods.
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 2009 fS E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2009 fS E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2009 fS E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2009 fS E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2009 fS E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2009 fS E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 9, 2026.
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