Esec
2100 hS i
The Esec 2100 hS i is a die bonder. The Esec 2100 hS i is designed for epoxy die attach applications. The Esec 2100 hS i supports wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in the assembly flow after wafer preparation and before later packaging steps that secure the die and build the finished device.
Applications
The Esec 2100 hS i is intended for epoxy die attach applications.[1]
The Esec 2100 hS i supports QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA package types.[1]
- Epoxy die attach applications
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options6
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec 2100 hS | 3rd generation | — | Base model in the same product family. | besi.com[1] |
| Esec 2100 hS iXplus | — | — | Related product variant named on the product page. | besi.com[1] |
| Esec 2100 sD advanced i | — | — | Related product variant named on the product page. | besi.com[1] |
| Esec 2100 hS i | — | — | Related product variant named on the product page. | besi.com[1] |
| Esec 2100 SC | — | — | Related product variant named on the product page. | besi.com[1] |
| Esec 2100 SSI | — | — | Related product variant named on the product page. | besi.com[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What die attach method does the Esec 2100 hS i use?
The Esec 2100 hS i uses epoxy die attach.[1]
What wafer sizes does the Esec 2100 hS i support?
The Esec 2100 hS i supports wafer sizes from 4 inches to 12 inches on 8 inch or 12 inch wafer frames.[1]
What die size range does the Esec 2100 hS i support?
The Esec 2100 hS i supports die sizes from 0.25 millimeter with the Small Die Kit to 20 millimeters.[1]
What is the listed bonding accuracy of the Esec 2100 hS i?
The Esec 2100 hS i has a listed bonding accuracy of 20 µm at 3 sigma, with a 15 µm option.[1]
What package families does the Esec 2100 hS i target?
The Esec 2100 hS i targets QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA applications.[1]
Not publicly documented
The following facts about the 2100 hS i are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 hS i are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 hS i are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 hS i are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 hS i is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 hS i are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 9, 2026.
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