Waferpedia

Esec

Datacon 2200 evo hS

Packaging & Bonding4"3rd generationEsec Datacon 2200 evo hS family
Research Quality: 60% complete
LinkedIn X Email

The Esec Datacon 2200 evo hS is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo hS is a 3rd generation 300 mm high-speed platform. The Esec Datacon 2200 evo hS has a bonding accuracy of 20 µm at 3σ.[1]

Datacon 2200 evo hS — besi.com
Fig. 01Datacon 2200 evo hSbesi.com[1]

  • Plate 01Besi Datacon 2200 evo and Datacon 8800 Series die bonder /die bonding machine

    GEEKVALUE SMT SolutionsWatch on YouTube

  • Plate 02Datacon 2200 EVO Demo Video

    Ollie Dunne Tara SemiWatch on YouTube

  • Plate 03BESI Datacon Die Bonder/bonding machine: datacon 2200 evo/8800 FC Quantum

    GEEKVALUE SMT SolutionsWatch on YouTube

  • Plate 04Auto calibration Datacon 2200 evo plus

    HJ Tech SolutionsWatch on YouTube

Wafer size

4"

Performance

20 µm @ 3σ (15 µm option)[1]

What it is

The Datacon 2200 evo hS is a die bonder for multi module attach.[2]

The Datacon 2200 evo hS is an automatic die attach platform with a bond force range of 0.5 N to 75 N, an X/Y placement accuracy of ± 7 µm, and a theta placement accuracy of ± 0.10°.[3][2]

How it works

The Datacon 2200 evo hS supports hot and cold processes including epoxy, soldering, thermo-compression, and eutectic attachment.[2]

The Datacon 2200 evo hS uses a pick and place head, a heated bond head option up to 450 C, and a standard bond head with 0° to 360° rotation.[2][3]

Where it fits in the process flow

The Datacon 2200 evo hS is used with wafer sizes from 4 inch to 12 inch and with frame sizes FF070, FF105, FF108, and FF123.[2][3]

Applications

The Datacon 2200 evo hS is intended for epoxy die attach and multi-chip production.[2]

The Datacon 2200 evo hS can place die from 0.18 mm to 5 mm in hS mode and die thicknesses from 0.05 mm to 2 mm.[2][3]

  • TSOP
  • FBGA

What do the numbers mean?

Wafer handling6

Wafer size
4" to 12" (on 8" or 12" wafer frames)[1]
Accurate?
Wafer size
4" - 12" (SEMI M1)[2]
Accurate?
Substrate working range
13" x 8" (325 mm x 200 mm)[2]
Accurate?
Wafer size
4 to 12 Inches[3]
Accurate?
Wafer die attach size
0.18 to 5 mm[3]
Accurate?
Wafer die thickness
0.05 to 2 mm[3]
Accurate?

Performance5

Bonding accuracy
20 µm @ 3σ (15 µm option)[1]
Accurate?
X/Y placement accuracy
± 7 µm @ 3 sigma[2]
Accurate?
Theta placement accuracy
± 0.10° @ 3 sigma[2]
Accurate?
X Y placement accuracy
± 7 µm[3]
Accurate?
Theta placement accuracy
± 0.10 Degree[3]
Accurate?

Dimensions & facilities6

Leadframe size
Length: 90 to 300 mm; Width: 23 to 100 mm[1]
Accurate?
Machine dimensions
1785 x 1448 x 1400 mm (W x D x H)[1]
Accurate?
Machine dimensions (LxDxH)
1,160 mm x 1,225 mm x 1,750 mm[2]
Accurate?
Weight
1,300 kg[2]
Accurate?
Net weight
1300 kg[3]
Accurate?
Overall dimensions
1160 x 1225 x 1750 mm[3]
Accurate?

Configuration & options20

Machine type
Die Bonder[1]
Accurate?
Generation
3rd generation[1]
Accurate?
Platform
300 mm high speed platform[1]
Accurate?
Bonding method
Epoxy[1]
Accurate?
Cycle time
120 ms with Liquid Cooling option[1]
Accurate?
Die size
0.25 mm (with Small Die Kit) to 20 mm[1]
Accurate?
Bond force
0.5 N to 75 N programmable[2]
Accurate?
Die attach speed
up to 12,000 UPH/module[2]
Accurate?
Bond head rotation
0° - 360° rotation[2]
Accurate?
Heated bond head
up to 450°C (optional)[2]
Accurate?
Uptime
> 98 %[2]
Accurate?
Yield
> 99.95 %[2]
Accurate?
Die size
0.18 mm - 5 mm (hS mode)[2]
Accurate?
Die thickness
0.05 - 2 mm[2]
Accurate?
Frame size
FF070, FF105, FF108, FF123; automatic change (others on request)[2]
Accurate?
Chip tray formats
Waffle pack / Gel-Pak® 2" x 2" and 4" x 4"; JEDEC tray on request[2]
Accurate?
Standard bond head rotation
0 Degree to 360 Degree[3]
Accurate?
Bond force
0.5 to 75 N programmable[3]
Accurate?
Heated bond head
450 degree C[3]
Accurate?
Placement speed
Up to 12000 UPH[3]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What type of machine is the Datacon 2200 evo hS?

The Datacon 2200 evo hS is a die bonder for multi module attach.[2]

What placement accuracy does the Datacon 2200 evo hS provide?

The Datacon 2200 evo hS provides X/Y placement accuracy of ± 7 µm and theta placement accuracy of ± 0.10°.[2][3]

What die size range does the Datacon 2200 evo hS support?

The Datacon 2200 evo hS supports die attach sizes from 0.18 mm to 5 mm in hS mode.[2][3]

What substrates or carriers can the Datacon 2200 evo hS handle?

The Datacon 2200 evo hS can place die to substrates, boats, carriers, PCBs, leadframes, and wafers.[2]

Which attachment processes does the Datacon 2200 evo hS support?

The Datacon 2200 evo hS supports epoxy, soldering, thermo-compression, and eutectic processes.[2]

Not publicly documented

The following facts about the Datacon 2200 evo hS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Datacon 2200 evo hS are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Datacon 2200 evo hS are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Datacon 2200 evo hS are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Datacon 2200 evo hS are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Datacon 2200 evo hS is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]besi.com — besi.combesi.com
  2. [2]besi.com — besi.combesi.com
  3. [3]semiconductor.directory — semiconductor.directorysemiconductor.directory
Was this page accurate?

Last updated Oct 7, 2026.

Compare with similar tools

View all →
2009 fS EEsec

The Esec 2009 fS E is an epoxy die bonder for 300 mm high-speed die attach applications. The Esec 2009 fS E supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.

CategoryPackaging & BondingWafer4"
9 specs
Datacon 2200 evo hS vs 2009 fS E →
2100 hS iEsec

The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is a 300 mm high-speed platform with support for wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

CategoryPackaging & BondingWafer4"
10 specs
Datacon 2200 evo hS vs 2100 hS i →
2100 sD advanced iEsec

The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is described as a 3rd generation 300 mm high speed platform with 20 µm bonding accuracy and an optional 15 µm placement accuracy in High Accuracy Mode.

CategoryPackaging & BondingWafer4"
7 specs
Datacon 2200 evo hS vs 2100 sD advanced i →
505 Die AttachMRSI

The MRSI 505 Die Attach is a packaging and bonding machine for semiconductor assembly, used for die attach and multichip module work.

CategoryPackaging & BondingWafer4"
10 specs
Datacon 2200 evo hS vs 505 Die Attach →
Datacon 2200 evoEsec

The Datacon 2200 evo is a die bonder for epoxy die attach applications.

CategoryPackaging & BondingWafer4"
10 specs
Datacon 2200 evo hS vs Datacon 2200 evo →
Datacon 2200 evo advancedEsec

The Esec Datacon 2200 evo advanced is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo advanced is described as a flexible 300 mm high-speed platform with wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

CategoryPackaging & BondingWafer4"
7 specs
Datacon 2200 evo hS vs Datacon 2200 evo advanced →