Disco
DFD 6341 Automatic Dicing
What it is
How it works
General reference — not yet source-verifiedA dicing saw separates processed wafers into individual dies by moving a cutting blade along programmed scribe or street paths while holding the wafer on a chuck or support table.
An automatic dicing machine typically combines motion control, optical alignment, and spindle-driven cutting to place the blade accurately and repeatably across the wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedA dicing saw usually follows wafer thinning or other back-end preparation steps when the process flow requires singulation into separate chips.
Applications
The Disco DFD 6341 is used for wafer dicing in semiconductor manufacturing.[1]
What do the numbers mean?
Power & electrical3
- 50/60 Hz[1]
Wafer handling2
- Transfer[2]
Optics & imaging2
- Epi illumination oblique lighting[2]
Control & software1
Configuration & options22
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ADT 7500 Dicing— Same function class: Dicing & Grinding, UnknownCompare in depthsource[8]
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFD 6341 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6341 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6341 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6341 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6341 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6341 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]inventory listing
- [8]Equipment inventory listing
- [9]Equipment inventory listing
Last updated Oct 12, 2026.
Compare with similar tools
View all →
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
