Disco

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The Disco DAD 3350 is an automatic dicing saw.

The Disco DAG810 is a compact automatic surface grinder used for thinning silicon, III/V materials, glass types, wafers, stacked wafers, and chips.

The Disco DAD 2 H / 6 is an automatic dicing saw.

The Disco 841 (DFG 841) is a back grinder for semiconductor wafers, handling sizes from 4 to 8 inches with two-spindle, two-chuck table configuration.

The Disco DFD 6340 is an automatic dicing saw.

The Disco DFD 6362 is an automatic dicing saw for semiconductor wafer singulation, supporting 8-inch wafers.

The Disco DFD 8540 is a grinder manufactured by Disco.

The Disco DFL 7340 Fully Automatic is a fully automatic laser saw.

The Disco DFD 651 is a fully automatic dicing saw for semiconductor wafer dicing.

The Disco LEN 40 SSU 002 A is a vacuum unit.

The Disco DFD 650 is a fully automatic dicing saw with vintage years 1994, 1995, and 1997.

The Disco DFD 641 is a fully automatic dicing saw offered by Disco, with stated unit vintages of 1998, 1999, 2002, 2003, and 2005.

The Disco DFD 640 is a fully automatic dicing saw for cutting/slotting various wafers.

The Disco DFD 6341 is a fully automatic dual spindle dicing saw designed for Φ8-inch wafers, offering X-axis return speeds up to 1,000 mm/s.

The Disco DAD 552 is an automatic dicing saw.

The Disco DFD 6361 is an automatic dicing saw.

The Disco DAD3220 is an automatic dicing saw designed for compactness and compatibility with 6-inch wafers and 6x6-inch workpieces.

The Disco DFD 6361 is a fully automatic dicing saw designed for 300 mm wafers, featuring a facing dual-spindle design and Synchro Spindle for consistent cut quality.

The Disco DAD 3230 is an automatic dicing saw.

The Disco DAD 3241 is an automatic dicing saw for 8-inch workpieces, described by DISCO as a standard model for manual dicing machines.

The Disco DAD321 is an automatic dicing saw for silicon, glass, and pyrex wafers, with support for 100 mm and 150 mm wafers.

The Disco DGP 8761 is a polishing machine used in semiconductor manufacturing.

The Disco DFG 850 is a back grinder for semiconductor wafer thinning.

The Disco DTU 152 Water Temperature Controller is designed to maintain constant temperature and pressure for spindle cooling water and cutting water in dicing saws, while reducing water consumption and environmental impact through water circulation and filtration.

The Disco DFD 6340 is a fully automatic dicing saw designed for 8-inch wafers.

The Disco DCS 1440 is an automatic cleaning system used to clean workpieces cut on a dicing saw, supporting workpiece sizes up to 250 mm square.

The Disco DAD 322 is an automatic dicing saw for cutting semiconductor wafers.

The Disco DFG 840 is an automatic in-feed surface grinder for semiconductor wafer thinning, handling wafers from 4 to 8 inches.

The Disco DAD 522 is an automatic dicing saw.

The Disco DTU 1531 is a chiller.

The Disco DAD 651 is an automatic dicing saw used in semiconductor manufacturing.

The Disco DAD 322 is a dicing saw used to dice a wafer mounted on UV tape with a diamond blade.

The Disco DUT 152 TCU is a temperature control unit manufactured by Disco.

The Disco DFU 2 CR E is a cutting water filtration unit manufactured in 2009.

The DFD6750 is a fully automatic dicing saw that uses dual chuck tables to increase productivity, supports two spindle types (1.8 kW and 2.2 kW), and provides precise cutting with a cutting range of 300 mm.

The Disco DFD6450 is a fully automatic dicing saw with parallel dual spindles, designed for dicing and grooving applications on silicon, compound semiconductor wafers, ceramics, glass, and other materials.

The Disco DFD 641 is an automatic dicing saw.

The Disco DFD6240 is a fully automatic single-spindle dicing saw for 200 mm wafers, designed for dicing silicon and compound semiconductors and for cutting and grooving ceramics, glasses, and other materials.

The Disco DFD 6350 is an automatic dicing saw described with 6-inch and 8-inch wafer sizes.

The Disco DFL 7160 Laser Dicing is a fully automatic laser saw for Φ300 mm wafers.

The Disco DAD 321 is a wafer dicing saw used for dicing semiconductor wafers.

The Disco DTU 152 is a chiller model manufactured by Disco.

The Disco DFS 8960 Surface Planarization is a fully automatic surface planarization system for 8-inch and 12-inch wafers.

General referenceThe Disco DFD 6341 Automatic Dicing is an automatic dicing saw, a machine used in semiconductor and precision optics manufacturing to singulate individual devices from a substrate.

Disco dicing saw handles up to 8 inch substrates and is used for dicing silicon, bonded Si wafers, and glasses.

The Disco DAD 3220 is an automatic dicing saw with source-stated configurations including a 1.5 kW spindle, a 1000 watt spindle, and a 40,000 min spindle revolutions specification.

The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.

The Disco DAD 321 is an automatic dicing saw.

The Disco 3240 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Disco DAD 340 Wafer is a wafer dicing saw used in semiconductor back-end processing.

The Disco DCS1440 is an automatic cleaning system designed to clean workpieces cut on a dicing saw, supporting a diverse range of workpiece sizes and offering configurable cleaning sequences.