Disco
DFD 6341
The Disco DFD 6341 is a dicing saw (dicer) used for cutting wafers. The DFD 6341 requires a 3-phase electrical supply of 380-415 volts, 3 wires plus ground, at 50/60 Hz. Examples of the DFD 6341 were manufactured in 2016 and 2017.[1][2][3][4][5]
What it is
The Disco DFD 6341 is a dicer used in semiconductor manufacturing.[1]
How it works
General reference — not yet source-verifiedA dicer separates processed wafers into individual dies by cutting along predefined streets on the wafer surface.
A dicing machine in this class typically uses a precision spindle and cutting blade or related cutting mechanism to remove material along programmed cut paths.
Where it fits in the process flow
General reference — not yet source-verifiedA dicing step normally follows wafer-level processing and precedes singulated die transfer to later assembly operations.
Applications
General reference — not yet source-verifiedThe Disco DFD 6341 is used for singulating semiconductor wafers into individual devices.
A dicer in this class is used for wafer partitioning in microelectronic manufacturing workflows.
What do the numbers mean?
Power & electrical9
Configuration & options8
- 3 Wire + Ground[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
- Accretech SS 20 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the machine type?
It is a Disco DFD 6341 dicer.[1]
Not publicly documented
The following facts about the DFD 6341 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6341 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6341 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6341 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6341 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6341 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Equipment inventory listing
- [6]DAD3360 | 切割机 | 产品信息 | DISCO CORPORATION — disco.co.jp (May 13, 2026)web.archive.org
- [7]Equipment inventory listing
Last updated Oct 6, 2026.
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The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.
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