Disco
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The Disco DAD 321 is a semi-automatic dicing saw.[1]
A dicing saw operates by using a rotating blade with diamond abrasive to cut along predetermined lines on a wafer. Semi-automatic operation means the machine handles the cutting cycle automatically but requires manual intervention for loading and unloading workpieces.
Dicing is typically performed after wafer thinning and before die sorting or packaging. The process separates the wafer into individual chips that then undergo subsequent assembly steps.
The machine is used to cut semiconductor wafers made of materials such as silicon, gallium arsenide, or silicon carbide for integrated circuits, memory devices, and other microelectronic components.
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The following facts about the DAD 321 Semi-Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 321 Semi-Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 321 Semi-Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 321 Semi-Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD 321 Semi-Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD 321 Semi-Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
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