Comparison ledger
Lapmaster 15, Meyer Burger DW 288 S 4 Diamond, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | DW 288 S 4 DiamondMeyer Burger |
|---|---|---|
| OEM | Lapmaster | Meyer Burger |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 15 | Meyer Burger DW 288 |
| Specifications | ||
| Input Power | 110 Vac[1] | — |
| Plate Diameter | 15 inches (381 mm)[2] | — |
| Number of Conditioning Rings | 3[2] | — |
| Ring ID | 5.5 inches (140 mm)[2] | — |
| Standard RPM | 60[2] | — |
| RPM Range (Variable Speed Drive) | 0-60[2] | — |
| Drive Motor - Lapper | 0.5 HP (0.37 kW)[2] | — |
| Drive Motor - Polisher | 0.75 HP (0.56 kW)[2] | — |
| Length | 25 inches (635 mm)[2] | — |
| Width | 20 inches (508 mm)[2] | — |
| Height | 24 inches (610 mm)[2] | — |
| Estimated Shipping Weight | 285 lbs (129.3 kg)[2] | — |
| Configuration | — | Wire Management System WM2[3] |
| Operating hours of Mc | — | 18,534 hours[3] |
| Operating hours of automatic Mc | — | 453 hours[3] |
| Operating hours of main drive | — | 534 hours[3] |
| 13112403/2 | — | Way Solenoid Valve DN4 reference 10040439 (1)[3] |
| 1310366 | — | Cutting Fluid additive ADDITIVEA33 ref BLASER 29106020001 (1)[3] |
| 1310362 | — | Beam DMT710 420x50x16mm 100mm radius ref 10266500 (95)[3] |
| 1310361 | — | Beam DMT710 420x50x16mm 75mm radius ref 10266493 (175)[3] |
| 1310363 | — | Beam DMT710 carre 156 420x156x16mm ref 10266501 (95)[3] |
| 1310364 | — | Fil diamante 12 PLAU, 60KM, MB50 ref 12PLAU0F31560A (6)[3] |
| Manufacturer | — | Meyer Burger[3] |
| Model | — | DW 288 S 4[3] |
| Category | — | Dicing & Grinding[4] |
| Machine type | — | Multi Wire Saw[5] |
| Application | — | Smart slicing technology for sapphire, and other hard and brittle materials[5] |
| Process | — | Slicing semiconductor silicon and sapphire into wafer[5] |
| Work piece dimensions | — | Max. Ø 8″ × 420 mm or ≤ 210 × 420 mm[6] |
| Web length | — | 420 mm[6] |
| Wire speed | — | 25 m/s (1500 m/min)[6] |
| Wire acceleration | — | 8 m/s² (< 4 s)[6] |
| Min. wire diameter | — | 100 μm[6] |
| Max. wire tension | — | 45 N[6] |
| Rocking principle | — | Rocking of work piece[6] |
| Rocking angle | — | ± 12°[6] |
| Wire guide roller axis distance | — | 540 mm[6] |
| Cutting fluid tank | — | 240 l[6] |
| Machine dimensions | — | 3620 × 1780 × 3010 mm[6] |
| Machine weight | — | 10500 kg[6] |
| Power & electrical | — | Standard Europe power management (400V, 230V Schuko plugs)[4] |
| US electrical conversion | — | UL conversion and voltage conversion (480V, 110V plugs)[4] |
| Wire management system | — | WM2[3] |
| Cutting fluid media module | — | Saphir cutting fluid media module with long filter[3] |
| Cutting fluid manifold | — | Without regulation valves, 1 mechanical flow meter, and flow bars[3] |
| Tank drain | — | With hand valve[3] |
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