Datacon 2200 evo alternatives

4"

Packaging & Bonding

The Esec 2009 fS E is an epoxy die bonder for 300 mm high-speed die attach applications. The Esec 2009 fS E supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.

4"

Packaging & Bonding

The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is a 300 mm high-speed platform with support for wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

4"

Packaging & Bonding

The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is described as a 3rd generation 300 mm high speed platform with 20 µm bonding accuracy and an optional 15 µm placement accuracy in High Accuracy Mode.

4"

Packaging & Bonding

The MRSI 505 Die Attach is a packaging and bonding machine for semiconductor assembly, used for die attach and multichip module work.

4"

Packaging & Bonding

The Esec Datacon 2200 evo advanced is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo advanced is described as a flexible 300 mm high-speed platform with wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

4"

Packaging & Bonding

The Esec Datacon 2200 evo hF is a die bonder on Besi's 3rd-generation 300 mm high-speed platform. The Esec Datacon 2200 evo hF is specified for epoxy die attach applications and supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.