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Plasma-Therm

Unaxis 790 RIE

EtchPlasma-Therm Unaxis 790 family
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Unaxis 790 RIE — Inventory photo
Fig. 01Unaxis 790 RIEInventory photo[1]

Power

RF Source Gen Freq. = 13.56mhz[1]

Gas delivery

Gases:[1]

What it is

The Plasma-Therm Unaxis 790 RIE is a reactive ion etcher used for semiconductor etch processing.[1]

How it works

General reference — not yet source-verified

A reactive ion etcher uses a plasma to remove material from exposed areas of a wafer surface. The process combines chemical reaction with ion-assisted directionality to shape etched features.

Where it fits in the process flow

General reference — not yet source-verified

A reactive ion etcher sits in the pattern-transfer portion of semiconductor fabrication. The tool transfers lithographic patterns into a film or substrate after a mask or resist has defined the areas to be opened.

Applications

General reference — not yet source-verified

Reactive ion etchers are used for anisotropic dry etching of semiconductor films and patterned layers. The class is used where controlled feature transfer and directional etch profiles are needed.

What do the numbers mean?

Power & electrical2

RF Source Gen Freq. = 13.56mhz[1]
Accurate?
RF source frequency
13.56 MHz[1]
Accurate?

Wafer handling1

Wafer size
6 inch[1]
Accurate?

Gas & chemistry2

Gases:[1]
Accurate?
Process gases
SF6, CHF3, CF4, O2, He, Ar, N2[1]
Accurate?

Configuration & options7

SF6[1]
Accurate?
CHF3[1]
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CF4[1]
Accurate?
O2[1]
Accurate?
AR[1]
Accurate?
N2[1]
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Tool type
Reactive Ion Etcher (RIE)[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationGases:[1]
  • ConfigurationRF Source Gen Freq. = 13.56mhz[1]
  • Process gasesSF6, CHF3, CF4, O2, He, Ar, N2[1]
  • RF source frequency13.56 MHz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of etch tool is the Plasma-Therm Unaxis 790?

The machine is a reactive ion etcher.[1]

Which process gases are specified for the Plasma-Therm Unaxis 790 RIE?

The specified gases are SF6, CHF3, CF4, O2, He, Ar, and N2.[1]

Not publicly documented

The following facts about the Unaxis 790 RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unaxis 790 RIE are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Unaxis 790 RIE are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Unaxis 790 RIE are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Unaxis 790 RIE are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Unaxis 790 RIE is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Inventory photo
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Last updated Oct 6, 2026.

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