Waferpedia

Comparison ledger

200 ACUversusUnaxis 790 RIE

Axcelis 200 ACU, Plasma-Therm Unaxis 790 RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Unaxis 790 RIEPlasma-Therm
OEMAxcelisPlasma-Therm
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Plasma-Therm Unaxis 790
Specifications
ConfigurationParts Machine[1]Gases:[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]Reactive Ion Etcher (RIE)[5]
Wafer size200mm[3]6 inch[5]
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Process gases—SF6, CHF3, CF4, O2, He, Ar, N2[5]
RF source frequency—13.56 MHz[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing