Novellus
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In semiconductor fabrication, PVD sputtering is used after photolithography and etching steps to deposit metal layers for interconnects, contacts, and barrier films. The Novellus 3290 is positioned in the deposition module of a fab, typically upstream of chemical-mechanical planarization or subsequent patterning steps.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Novellus / Varian 3290 STQ | — | — | A sputtering system designed for 6-inch wafers. | waferpedia.com[5] |
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The following facts about the 3290 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3290 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 3290 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3290 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3290 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 3290 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 10, 2026.
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