Kulicke & Soffa
Rapid Plus
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The K&S Rapid Plus is a wire bonder. The K&S Rapid Plus includes a calibration kit and NUTEK input/output conveyors.[1][2]
What it is
How it works
General reference — not yet source-verifiedA wire bonder joins fine conductive wire from a die or substrate pad to a package terminal or other interconnect point.
A wire bonder in this class uses a bonding head and precision motion control to place each bond at a defined site.
Where it fits in the process flow
General reference — not yet source-verifiedA wire bonder belongs in the packaging flow after the die has been prepared for interconnect attachment.
A wire bonder supports the electrical connection step that precedes later package assembly and test activities.
Applications
The Rapid Plus is used for wire bonding in semiconductor packaging and bonding work.[1]
The Rapid Plus entry includes a calibration kit and NUTEK input and output conveyors.[2][1]
What do the numbers mean?
Configuration & options3
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Hybond 572 A 40 Thermosonic Wire & Ribbon— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- F&K Delvotec G 5 62000— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- West Bond 7476 E 79 Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- Shinkawa UTC 1000— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Rapid Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rapid Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Rapid Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Rapid Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Rapid Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Rapid Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Rapid Plus — Kulicke & Soffa | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [2]Inventory photo
Last updated Oct 8, 2026.
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The Hybond 572 A 40 is a thermosonic wire and ribbon bonder with long-reach bonding, wire and ribbon capability, and a 6 x 8.5 inch work platform.
The WestBond 7476 E 79 Wedge is a wedge wire bonder with deep access and several specified operating features.
The F&K Delvotec G 5 62000 is a wire bonder described as running with 25 µm wire and a ball/wedge bondhead.
The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.
