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Comparison ledger

572 A 40 Thermosonic Wire & RibbonversusRapid Plus

Hybond 572 A 40 Thermosonic Wire & Ribbon, Kulicke & Soffa Rapid Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Packaging & Bonding, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
Rapid PlusKulicke & Soffa
OEMHybondKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHybond 572 A 40 Thermosonic Wire & RibbonKulicke & Soffa Rapid
Specifications
ConfigurationLong reach[2]Includes:[1]
OptionsOP-06B, OP-08A-LED, OP-17, OP-31, WST-15CM, T91S, 9400[2]—
Ultrasonic systemPLL self-tuning, 62.5 KHz (±2.5KHz) nominal[3]—
Ultrasonic power range0-1 watt on Low setting (default), 0-2 watts on High setting[3]—
Bond time range10 - 400 mSec[3]—
Bond force range15 - 120 grams[3]—
Temperature control rangeAmbient to 250° C[3]—
Bondable wire diameters0.5 to 2.0 mils (12.7 to 50.8 µm)[3]—
Bondable ribbon dimensionsUp to 1 x 10 mils (25.4 x 254 µm)[3]—
Bondable wire/ribbon materialsGold, aluminum, copper, silver, platinum[3]—
Bond head movementManual[3]—
Bond actuationSwitch at fixed height, actuated by lever[3]—
Z axis travel0.5 in (12.7 mm) / 60-100 mils (1.52-2.54 mm)[3]—
X-Y table motion/travel4:1 manual manipulator standard / 0.9 x 0.9 in (23 x 23 mm) max[3]—
Input power requirements110VAC 50/60Hz @ 10A max; 240VAC with OP-12[3]—
Minimum bench space requiredWidth 25 in, Depth 30 in (63.5 x 76.2 cm)[3]—
Unit weight70 lbs (31.8 kg)[4]—
Shipping weight150 lbs (68.2 kg)[4]—
Vacuum requirement20 inHg minimum[3]—
Industry standardsCE certified[3]—
Deep vertical access0.59 in (1.49 cm)[3]—
Long horizontal reach6.5 in (16.5 cm)[3]—
Work platform size (X-Y)10 x 12 in (25 x 30 cm)[4]—
TypeThermosonic wedge bonder[5]—
Bonding capabilityWire and ribbon bonding[3]—
Access typeDeep-access, long-reach[5]—
Soft Touch technologyHYBOND Soft Touch bonding technology[3]—
Wire feedMotorized vertical wire feed[3]—
Z-axis controlIndependent Z-axis lever for bonding tool control[3]—
Stitch capability1-1-2, 1-2-2, and 1-2-1[3]—
Spool mounts0.5 inch and 2 inch spool mounts[3]—
Work platform6 x 8.5 inch work platform[5]—
Wire diameter range0.5 to 2.0 mils[3]—
Ribbon dimensionUp to 1 x 10 mils[3]—
Bondable materialsGold, aluminum, copper, silver, platinum[3]—
Z travel0.5 in[3]—
Unit weight / shipping weight70 lbs / 150 lbs[3]—

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]hybond.comhybond.com
  4. [4]hybond.comhybond.com
  5. [5]waferpedia.comwaferpedia.com