Kulicke & Soffa

IConn MEM Plus

Q: What bond placement accuracy does the IConn MEM Plus achieve?

The total bond placement accuracy is 2.0 µm at 3 sigma.

Q: What wire diameters are supported?

The IConn MEM Plus supports gold and silver alloy wire from 0.6 mil to 2.0 mil diameter.

Q: What is the minimum bond pad pitch?

The ultra fine pitch capability is 35 µm.

Q: What is the bonding area?

The bonding area is 56 mm in X and 80 mm in Y.

Q: What is the maximum wire length for 1.0 mil wire?

The maximum wire length is 7.6 mm with 1.0 mil wire and 3.0 mm with 0.6 mil wire.

Q: What is the minimum loop height?

The minimum loop height with 0.6 mil wire is 40 µm, using the Power Series Low Loop capability.

Packaging & Bonding Kulicke & Soffa IConn MEM Plus family

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IConn MEM Plus — Inventory photo — Fig. 01IConn MEM PlusInventory photo^[1]

Power

200-240 VAC, single phase, 50/60 Hz^[2]

Vacuum

3.52 kg/sq cm (50 psi)^[2]

Performance

2.0 μm @ 3 sigma^[2]

Gas delivery

0.9 liters/min^[2]

What it is

General reference — not yet source-verified

Wire bonders are semiconductor packaging tools that create electrical interconnections between an integrated circuit die and its package substrate using fine wire. The Kulicke & Soffa IConn MEM Plus is a wire bonder designed for memory device assembly.

How it works

General reference — not yet source-verified

Thermosonic wire bonding uses a combination of heat, ultrasonic energy, and force to weld wire to bond pads. A capillary tool feeds the wire and forms a ball bond on the die pad, then a stitch bond on the substrate.

Where it fits in the process flow

General reference — not yet source-verified

In semiconductor packaging, wire bonding follows die attach and precedes encapsulation or molding. For memory packages, multiple dies are stacked and wire bonded in sequence. The IConn MEM Plus is positioned in the assembly line to bond stacked die memory packages.

What do the numbers mean?

Power & electrical1

Input Voltage: 200-240 VAC, single phase, 50/60 Hz^[2]

Vacuum & pumping2

Minimum Air Pressure: 3.52 kg/sq cm (50 psi)^[2]
Nominal Air Consumption: 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)^[2]

Gas & chemistry1

Cover Gas Consumption (nominal): 0.9 liters/min^[2]

Performance1

Total Bond Placement Accuracy: 2.0 μm @ 3 sigma^[2]

Dimensions & facilities3

Minimum Loop Height (0.6 mil wire): 40 μm^[2]
Footprint: 889 mm x 1009 mm (35" x 39.7")^[2]
Weight (machine only): 620 kg (1367 lbs)^[2]

Configuration & options11

Ultra Fine Pitch: 35 μm^[2]
Gold wire diameter: 0.6 mil to 2.0 mil^[2]
Silver alloy wire diameter: 0.6 mil to 2.0 mil^[2]
Bonding Area (X): 56 mm^[2]
Bonding Area (Y): 80 mm^[2]
Maximum Wire Length (1.0 mil wire): 7.6 mm^[2]
Maximum Wire Length (0.6 mil wire): 3.0 mm^[2]
Power Consumption (nominal): 1.5 KVA^[2]
Power Consumption (max): 2.6 KVA^[2]
Setup Time (same leadframe type): < 4 min^[2]
Setup Time (different leadframe type): < 8 min^[2]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Input Voltage200-240 VAC, single phase, 50/60 Hz^[2]
Minimum Air Pressure3.52 kg/sq cm (50 psi)^[2]
Nominal Air Consumption185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)^[2]
Cover Gas Consumption (nominal)0.9 liters/min^[2]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What bond placement accuracy does the IConn MEM Plus achieve?

The total bond placement accuracy is 2.0 µm at 3 sigma.^[2]

What wire diameters are supported?

The IConn MEM Plus supports gold and silver alloy wire from 0.6 mil to 2.0 mil diameter.^[2]

What is the minimum bond pad pitch?

The ultra fine pitch capability is 35 µm.^[2]

What is the bonding area?

The bonding area is 56 mm in X and 80 mm in Y.^[2]

What is the maximum wire length for 1.0 mil wire?

The maximum wire length is 7.6 mm with 1.0 mil wire and 3.0 mm with 0.6 mil wire.^[2]

What is the minimum loop height?

The minimum loop height with 0.6 mil wire is 40 µm, using the Power Series Low Loop capability.^[2]

Not publicly documented

The following facts about the IConn MEM Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IConn MEM Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the IConn MEM Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the IConn MEM Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IConn MEM Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IConn MEM Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report