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Comparison ledger

101-149-053 Gold BoosterversusIConn MEM Plus

Branson 101-149-053 Gold Booster, Kulicke & Soffa IConn MEM Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
IConn MEM PlusKulicke & Soffa
OEMBransonKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterKulicke & Soffa IConn MEM Plus
Specifications
Configuration1:1.5[1]—
ManufacturerBranson[2]—
Model101-149-053[2]—
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Ultra Fine Pitch—35 μm[4]
Gold wire diameter—0.6 mil to 2.0 mil[4]
Silver alloy wire diameter—0.6 mil to 2.0 mil[4]
Bonding Area (X)—56 mm[4]
Bonding Area (Y)—80 mm[4]
Total Bond Placement Accuracy—2.0 μm @ 3 sigma[4]
Maximum Wire Length (1.0 mil wire)—7.6 mm[4]
Maximum Wire Length (0.6 mil wire)—3.0 mm[4]
Minimum Loop Height (0.6 mil wire)—40 μm[4]
Input Voltage—200-240 VAC, single phase, 50/60 Hz[4]
Power Consumption (nominal)—1.5 KVA[4]
Power Consumption (max)—2.6 KVA[4]
Footprint—889 mm x 1009 mm (35" x 39.7")[4]
Weight (machine only)—620 kg (1367 lbs)[4]
Minimum Air Pressure—3.52 kg/sq cm (50 psi)[4]
Nominal Air Consumption—185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)[4]
Cover Gas Consumption (nominal)—0.9 liters/min[4]
Setup Time (same leadframe type)—< 4 min[4]
Setup Time (different leadframe type)—< 8 min[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]elexind.itelexind.it