CHA
The CHA SSC-1000 is a sputtering system. The CHA SSC-1000 is a 10-inch system. The CHA SSC-1000 can be configured with up to four RF or DC cathodes.[1][2][3][4]

Wafer size
10 in.
Power
Up to four RF or DC cathodes[1]
The CHA SSC-1000 is a sputtering system for deposition work. The SSC-1000 is a multi-station system configured with up to four RF or DC cathodes.[1][2][4]
The SSC-1000 supports sputter-up or sputter-down operation. The SSC-1000 uses upper and lower base plates, and the base plates move out of the cabinet for substrate loading and station access.[1][2]
The SSC-1000 provides substrate access from the top or bottom of the process chamber. The SSC-1000 includes a rotating fixture for multiple substrates and a rotating shutter for pre-deposition and thickness cutoff control.[2]
The SSC-1000 is a substrate deposition platform rather than a lithography or etch tool. The SSC-1000 is used where controlled thin-film growth on wafers or other substrates is required.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The SSC-1000 is a sputtering system for high-vacuum deposition.[2][5]
The SSC-1000 can be configured with up to four RF or DC cathodes.[1][2][4]
The following facts about the SSC-1000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SSC-1000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SSC-1000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SSC-1000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SSC-1000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SSC-1000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 10, 2026.
CHA SE-1000 is a sputtering system described as a 10-inch system.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.