Buehler
69 1100
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Buehler 69 1100 is a grinding tool used in semiconductor dicing and grinding applications.[1][2]
What it is
General reference — not yet source-verifiedThe Buehler 69 1100 is a grinding machine used in semiconductor manufacturing. Grinding machines of this class thin semiconductor wafers after device fabrication to reduce package size, improve thermal performance, and enable die stacking.
How it works
General reference — not yet source-verifiedWafer grinding machines operate by clamping a wafer onto a porous ceramic chuck using vacuum. A rotating grinding wheel, typically diamond-impregnated, is pressed against the backside of the wafer while coolant is applied to remove heat and debris. The chuck rotates in the opposite direction to maintain uniform material removal across the wafer surface.
The process can be performed in multiple steps: a coarse grind for rapid stock removal, followed by a fine grind to achieve the target thickness and surface finish. Some machines incorporate in-situ thickness measurement to control the final wafer thickness precisely.
Applications
General reference — not yet source-verifiedThe primary application of a wafer grinder is thinning silicon wafers for memory, logic, and power semiconductor devices. Grinding is also used for compound semiconductor wafers such as gallium arsenide and gallium nitride, where precise thickness control is required for subsequent processing steps.
What do the numbers mean?
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the 69 1100 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 69 1100 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 69 1100 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 69 1100 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 69 1100 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 69 1100 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]69 1100 — Buehler | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 29, 2026.
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