ASM
Laser 1205
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The ASM Laser 1205 (also designated ALSI LASER1205) is a high-precision laser system developed by ASMPT ALSI for full-cut dicing and grooving of semiconductor wafers. The system integrates multi-beam laser processing technology and is offered in four configurations: Dicing IR, Dicing UV Plus, Grooving UV, and Grooving UV-USP.[1]
How it works
The ASM Laser 1205 achieves a positional accuracy of less than 1.5 µm and a heat-affected zone (HAZ) under 2 µm. Dicing width is less than 12 µm for multi-beam processing on 100 µm silicon. The system supports both UV (355 nm) and IR wavelengths, with pulse durations in the picosecond range (0.5–10 ps), enabling minimal thermal impact on the workpiece.[1][2]
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
What is the positional accuracy of the ASM Laser 1205?
The positional accuracy is less than 1.5 µm, with reproducibility also below 1.5 µm.[1]
What is the minimum dicing width achievable?
The minimum dicing width is less than 12 µm for multi-beam processing on 100 µm silicon wafers.[1]
What wafer thickness range does the system support?
The system supports wafer thicknesses from 10 µm to 300 µm.[1]
What are the available configurations of the machine?
Four configurations are available: Dicing IR, Dicing UV Plus, Grooving UV, and Grooving UV-USP, each tailored to different materials and processes.[1]
What is the size of the heat-affected zone (HAZ)?
The heat-affected zone is less than 2 µm on 100 µm silicon, ensuring minimal thermal damage.[1]
Not publicly documented
The following facts about the Laser 1205 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the Laser 1205 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Laser 1205 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Laser 1205 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Laser 1205 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Laser 1205 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]ALSI LASER1205 | ASMPT — alsi.semi.asmpt.comalsi.semi.asmpt.com
- [2]ASM Laser 1205 晶圆激光划片机资料-全套 | 半导体设备资料网 — semimodel.comsemimodel.com
- [3]Equipment inventory listing
Last updated Sep 24, 2026.
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