Applied Materials
Centura Enabler Oxide
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
Applications
General reference — not yet source-verifiedThe Applied Materials Centura Enabler is designed for etching oxide layers such as silicon dioxide or aluminum oxide. Applications include removing oxide from wafer surfaces, patterning oxide layers, and preparing surfaces for subsequent processing.
What do the numbers mean?
Configuration & options6
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the general operating principle of this class of etch tool?General reference — not yet source-verified
The tool uses a plasma-enhanced, reactive ion etch process. A plasma is struck in a low-pressure gas mixture, and the applied RF bias directs ions to the wafer, enabling anisotropic (directional) etching of the dielectric film without significant undercut or damage to the underlying layer.
What are the key process control parameters for such a system?General reference — not yet source-verified
Key parameters include chamber pressure, gas flow rates and ratios, RF power (both source and bias), wafer temperature, and electrode spacing. Controlling these parameters is essential for achieving uniform etch rates, good selectivity, and the desired feature profile across the wafer.
How does this class of tool ensure process repeatability?General reference — not yet source-verified
Repeatability is maintained through automated wafer handling in a vacuum environment, which minimizes exposure to ambient moisture and contaminants. Additionally, the system uses precise mass flow controllers, pressure regulators, and temperature control, along with chamber seasoning and cleaning routines, to maintain consistent chamber conditions over time.
Not publicly documented
The following facts about the Centura Enabler Oxide are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura Enabler Oxide are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Centura Enabler Oxide are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura Enabler Oxide are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura Enabler Oxide is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura Enabler Oxide are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]Equipment inventory listing
- [7]Equipment inventory listing
Last updated Sep 27, 2026.
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