ADT
7200 Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ADT 7200 Dicing Saw is a dicing saw. The ADT 7200 Dicing Saw has an 8 inch wafer size. The ADT 7200 ProDice is a dicing and scribing saw.[1][2]
What it is
How it works
The ADT 7200 features a precision blade spindle for clean cuts. The machine includes an integrated alignment and vision system, a motorized X-Y stage, and automatic depth control. Operation is managed through a touchscreen or PC interface. The unit has a compact footprint suitable for cleanroom use.[2]
Where it fits in the process flow
General reference — not yet source-verifiedDicing is a back-end process performed after wafer fabrication and before packaging. The wafer is typically thinned via grinding before dicing.
After dicing, individual die are picked and placed onto lead frames or substrates for packaging.
Applications
General reference — not yet source-verifiedDicing saws are used in the separation of a wide range of materials beyond standard silicon, including compound semiconductors used in optoelectronics and power devices.
What do the numbers mean?
Power & electrical1
Wafer handling2
- Application
- High-accuracy scribing and dicing of silicon wafers, ceramics, glass, and compound semiconductors[2]
Performance1
- Features
- Precision blade spindle; integrated alignment and vision system; motorized X-Y stage; automatic depth control; touchscreen or PC interface[2]
Configuration & options6
Vintage & configurations
- 2013Manufactured[2]
ADT 7200 ProDice dicing and scribing saw manufactured in 2013.
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 7200 ProDice | — | 2013 | — | bidspotter.com[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power requirement240V[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kinds of materials are handled by this class of machine?General reference — not yet source-verified
Machines of this class are used on semiconductor and other precision substrates that require controlled singulation.
What is the main quality concern in dicing?General reference — not yet source-verified
The main concern is achieving accurate separation with minimal chipping, cracking, or contamination at the cut edge.
Not publicly documented
The following facts about the 7200 Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the 7200 Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7200 Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7200 Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 7200 Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 7200 Dicing are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]bidspotter.com — bidspotter.combidspotter.com
- [3]Equipment inventory listing
Last updated Oct 7, 2026.
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