Accretech

UF 200 Automatic Wafer

Research Quality: 40% complete

The Accretech / TSK UF 200 Automatic Wafer Prober is an automatic wafer prober. The Accretech / TSK UF 200 supports 8-inch wafer sizes. The Accretech / TSK UF 200 is used for wafer testing and probing applications.^[1]^[2]^[3]

UF 200 Automatic Wafer — Inventory photo — Fig. 01UF 200 Automatic WaferInventory photo^[3]

What it is

The Accretech / TSK UF 200 is an automatic wafer prober.^[1]^[10]^[11]^[2]^[3]

How it works

General reference — not yet source-verified

An automatic wafer prober holds the wafer on a vacuum chuck and moves it to align each die with the probe card needles. The probe card is planar and contains many fine needles that contact all bond pads of a single die simultaneously. The system then steps to the next die and repeats the process.

What do the numbers mean?

Wafer handling7

Chuck: Gold^[3]
Chuck Temp: Hot^[3]
Wafer size: 8 inch^[2]
Chuck material: Gold^[3]
Chuck temperature: Hot^[3]
Chuck temperature capability: Hot^[3]
Equipment type: Automatic Wafer Prober^[1]

Control & software1

Operating system version: 3 G 05 EH^[3]

Configuration & options5

Os Version: 3 G 05 EH^[3]
Os Version: 3 G 06 15^[6]
Make: Accretech / TSK^[1]
Model: UF 200^[1]
Vintage: 1999^[3]

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the model number of this wafer prober?

The model is UF 200.^[1]^[10]^[11]^[2]^[3]

Not publicly documented

The following facts about the UF 200 Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 200 Automatic Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 200 Automatic Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 200 Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 200 Automatic Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 200 Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report