Comparison ledger
Accretech UF 200 Automatic Wafer, Applied Materials 0720 06060 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 200 Automatic WaferAccretech | 0720 06060 PartApplied Materials |
|---|---|---|
| OEM | Accretech | Applied Materials |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 200 | Applied Materials 0720 06060 Part |
| Specifications | ||
| Chuck | Gold[1] | — |
| Chuck Temp | Hot[1] | — |
| Os Version | 3 G 05 EH[1] | — |
| Wafer size | 8 inch[3] | — |
| Chuck material | Gold[1] | — |
| Chuck temperature | Hot[1] | — |
| Operating system version | 3 G 05 EH[1] | — |
| Chuck temperature capability | Hot[1] | — |
| Make | Accretech / TSK[4] | — |
| Model | UF 200[4] | — |
| Equipment type | Automatic Wafer Prober[4] | — |
| Vintage | 1999[1] | — |
| Configuration | — | Contact Pin 24-20 Awg Crimp Gold Flash[5] |
Plan your fab
Building a Test & Probe process? Get a complete equipment list.
Open the fab equipment planner →