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23 entries
The Mattson Aspen II RTA is an etch tool that processes 8-inch wafers.
The Mattson Aspen II ICP LE is an etcher for 8-inch wafers, introduced in 1997.
The Mattson AST 280 RTP is a rapid thermal processing (RTP) system for semiconductor thermal/diffusion applications.
The Mattson Aspen is a family of plasma processing systems for strip, etch, and deposition, including the Aspen II and Aspen III platforms.
The Mattson Aspen II Asher is a semiconductor ashing tool offered by Mattson, with configurations supporting 6-inch and 8-inch wafer sizes.
The Mattson / Steag / AST 2900 RTP is a rapid thermal processor used in semiconductor manufacturing.
The Mattson Aspen III is a plasma processing platform offered in asher and plasma-enhanced chemical vapor deposition configurations, with variants supporting 200mm and 300mm wafers.
The Mattson Paradigme XP Light is an etcher used in semiconductor manufacturing.
The Mattson Paradigme (also styled as paradigmE) is a dry etch system used for advanced pattern multiplying etches at the 20 nm technology node and below.
The Mattson AST 2800 is a thermal processing tool in the AST 2800 family.
The Mattson Steag / AST Heatpulse 610 RTP is a rapid thermal process (RTP) system for 6-inch wafers with a temperature range of 400-1250 °C.
General referenceThe Mattson Helios RTP is a rapid thermal processing (RTP) system used for single-wafer thermal treatments in semiconductor manufacturing.
Mattson 8800 is a third-generation RTP tool developed for 0.25-micron process requirements and described as a 200 mm single-wafer RTP tool.
The Mattson SHS 2800 RTA is a rapid thermal anneal system described with front-end or tool-controller configurations, a ripple pyrometer for temperature measurement, and a jet venturi cooling system.
The Mattson / Steag / AST 2800 RTP System is a Rapid Thermal Process system.