Waferpedia

Tool family

Shinkawa UTC

ShinkawaPackaging & Bonding2 entries
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Models in this family

  1. UTC 1000

    The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.

  2. UTC 5000

    The Shinkawa UTC 5000 is a wire bonder that handles 12-inch wafers.

All entries

  1. UTC 1000Shinkawa

    The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.

    CategoryPackaging & Bonding
    40 specs
  2. UTC 5000Shinkawa

    The Shinkawa UTC 5000 is a wire bonder that handles 12-inch wafers.

    CategoryPackaging & Bonding
    5 specs