Shinkawa

The Shinkawa UTC 3000 is a wire bonder used in semiconductor packaging and bonding applications.

The Shinkawa SBB 1410 is a stud bump bonder produced by Shinkawa for semiconductor packaging and bonding applications.

The Shinkawa UTC 3000 WE Bonder is a wire bonder for 8-inch wafers.

The Shinkawa UTC 200 BI Super II is a wire bonder.

The Shinkawa UTC 200 Super is a wire bonder in the Packaging & Bonding category.

The Shinkawa SIL 1323 is a loader used in semiconductor manufacturing.

The Shinkawa UTC 300 BI is a wire bonder categorized under Packaging & Bonding equipment.

The Shinkawa UTC 475 BI Super is a wire bonder categorized under Packaging & Bonding.

The Shinkawa UTC 2000 is a wire bonder manufactured by Shinkawa.

The Shinkawa UTC 400 BI is a bonder used in semiconductor packaging and bonding.

The Shinkawa UTC 2000 Super is a wire bonder in the Packaging & Bonding category.

The CV-87 is a moving-coil seismic velocity sensor designed for monitoring applications that require a rugged design capable of handling the extreme temperatures experienced with many gas turbines.

The VM-21 Series is a signal conditioner that accepts signals from transducers and converts them to isolated 4-20 mADC or 1 to 5VDC signals.

The Shinkawa VM-25 Series is a compact condition monitor for rotating machinery with digital communication capabilities.

The VM-7 Series machinery protection systems meet API-670 standards and are designed for Turbine Supervisory Instrumentation on large utility turbine-generator sets.

The Shinkawa UTC 1000 Super is a wire bonder in the Packaging & Bonding category.

Shinkawa 8-inch package sorter for mold CSP and wafer level CSP applications.

The Shinkawa ACB 1000 is a wire bonder.

The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.

The VM-5 Series is a machinery protection system with individual backlit LCD displays and flexible rack options.

The Shinkawa UTC 5000 is a wire bonder that handles 12-inch wafers.