Waferpedia

Tool family

Oxford Instruments Plasmalab 100

Models in this family

  1. The Oxford Instruments Plasmalab 100 is a plasma-enhanced chemical vapor deposition (PECVD) system that handles wafers from 2 to 8 inches and is used for depositing silicon dioxide, silicon nitride, and other dielectric films.

    Cited variants

    DesignationGenerationVintageChangesSource
    System 100 PECVD / FlexAL ALD (thermal/plasma) cluster system——Described as a cluster comprised of a FlexAL ALD system and a PlasmaLab 100 PECVD system sharing a common loadlock.uwaterloo.ca[1]
    Plasmalab 100 PECVD——Configured for plasma-enhanced chemical vapor depositionEquipment inventory listing[2]
    Plasmalab 100 ICP Dielectric Etcher——Configured for fluorine-based dielectric etching with ICPcnfusers.cornell.edu[3]
    Plasmalab 100 ICP (Compound III-V)——Configured for compound III-V material etchingnanolab.berkeley.edu[4]
  2. The Oxford Instruments Plasmalab 100 ICP 180 RIE is an etch tool with a 6-inch wafer size and a 208V, 50/60Hz power spec.

  3. The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

  4. The Oxford Plasmalab 100 ICP-RIE is an inductively coupled plasma reactive ion etch system.

  5. Oxford Instruments Plasmalab 100 Plus RIE is a reactive ion etcher with a load-locked system and a gas module set up for Ar, O2, Cl2, and SiCl4.

  6. The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.

    Cited variants

    DesignationGenerationVintageChangesSource
    Plasmalab 100 Plus——Allows small batch processing for R&D and Pilot Production; supports up to 8''/200 mm wafers; load-locked systemclassoneequipment.com[5]
    Plasmalab 100 RIE (FL)——Configured for SiO2 plasma etching; supports wafer sizes up to 300 mm; 330 mm platen; water-cooled electrode; Advanced Energy RFX 600A RF generator; Alcatel turbo pump; blue PLC controlsemistarcorp.com[6]

All entries

  1. Plasmalab 100Oxford Instruments

    The Oxford Instruments Plasmalab 100 is a plasma-enhanced chemical vapor deposition (PECVD) system that handles wafers from 2 to 8 inches and is used for depositing silicon dioxide, silicon nitride, and other dielectric films.

    CategoryDepositionWaferφ2’, φ4’, φ6’, φ8’ single wafer auto transfer
    41 specs
  2. Plasmalab 100 ICP 180Oxford Instruments
    CategoryEtch
    3 specs
  3. Plasmalab 100 ICP 180 RIEOxford Instruments

    The Oxford Instruments Plasmalab 100 ICP 180 RIE is an etch tool with a 6-inch wafer size and a 208V, 50/60Hz power spec.

    CategoryEtch
    26 specs
  4. Plasmalab 100 ICP 380Oxford Instruments

    The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

    CategoryEtch
    6 specs
  5. Plasmalab 100 ICP-RIEOxford Instruments

    The Oxford Plasmalab 100 ICP-RIE is an inductively coupled plasma reactive ion etch system.

    CategoryEtch
    20 specs
  6. Plasmalab 100 Plus RIEOxford Instruments

    Oxford Instruments Plasmalab 100 Plus RIE is a reactive ion etcher with a load-locked system and a gas module set up for Ar, O2, Cl2, and SiCl4.

    CategoryEtch
    12 specs
  7. Plasmalab 100 RIEOxford Instruments

    The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.

    CategoryEtch
    25 specs

Sources

Sources (6)Every fact above is drawn from these public sources
  1. [1]uwaterloo.cauwaterloo.ca
  2. [2]Equipment inventory listing
  3. [3]cnfusers.cornell.educnfusers.cornell.edu
  4. [4]nanolab.berkeley.edunanolab.berkeley.edu
  5. [5]classoneequipment.comclassoneequipment.com
  6. [6]semistarcorp.comsemistarcorp.com