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Comparison ledger

HR 8500 III TW UV Detaperversus1000P

Nitto HR 8500 III TW UV Detaper, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMNittoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyNitto HR 8500 III TW UV DetaperYES 1000P
Specifications
Control MethodOne Board Micro Computer[1]—
Wafer Transfer Robot3-axis type[1]—
ConfigurationInstallation Environment:[1]Parallel plate[3]
Temperature25 ± 5 degrees C[1]—
Humidity45 ± 15%[1]—
OthersClean level ; Class 1,000 or more (Place where it will be subjected to direct sunlight)[1]—
Power1.5 kVA[1]1000 W[3]
For AirRc 3/8 screw[1]—
Lug with grounding linw (Cable LengthApprox. 5m)[1]—
OEMNitto Denko[1]—
ModelHR 8500 III TW UV[1]1000P[2]
Wafer Sizes8 inch[1]—
Clean levelClass 1,000 or more[1]—
Power SupplySingle Phase; AC 100 V ± 5%; 1.5 kVA; 50/60 Hz[1]—
Air SupplyDry Air; 0.5 MPa or more; 250 NL/min or more[1]—
Connection PortFor electrical power; For Air: Rc 3/8 screw; Lug with grounding linw (Cable Length: Approx. 5m)[1]—
System type—Plasma cleaning system[2]
Shelf configuration—Four 16 x 16 inch shelves[2]
Total capacity—1024 square inches[2]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[2]
Number of shelves—4[2]
Shelf size—16 x 16 inches[2]
Operation modes—Active, RIE, Downstream[2]
Sample size range—From smallest semiconductor chip to large flat panels[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]semistarcorp.comsemistarcorp.com