Waferpedia

Comparison ledger

DAD3241versus15

Disco DAD3241, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DAD3241Disco
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DAD3241Lapmaster 15
Specifications
Max. workpiece sizeΦ8”[1]—
X-/Y-axis cutting range210 mm[1]—
Cutting speed0.1-800 mm/s[1]—
Index positioning accuracy0.002/210 mm[1]—
Z-axis max. stroke32.2 mm[1]—
Moving resolution0.000002 mm[1]—
Repeatability accuracy0.001 mm[1]—
Θ-axis max. rotating angle320°[1]—
Rotation speed range6,000-60,000 rpm[1]—
X-axis cutting range210 mm[1]—
Y-axis cutting range210 mm[1]—
Spindle rated output1.8 kW at 60,000 min-1[3]—
Spindle rated torque0.29 N·m[3]—
Equipment dimensions650 × 950 × 1,670 mm[3]—
Equipment weightApprox. 550 kg[3]—
Axis driveServo motors on all axes (X, Y, and Z)[2]—
InterfaceXIS (Extended Interface System)[2]—
MicroscopeBuilt-in microscope[1]—
Input Power—110 Vac[4]
Plate Diameter—15 inches (381 mm)[5]
Number of Conditioning Rings—3[5]
Ring ID—5.5 inches (140 mm)[5]
Standard RPM—60[5]
RPM Range (Variable Speed Drive)—0-60[5]
Drive Motor - Lapper—0.5 HP (0.37 kW)[5]
Drive Motor - Polisher—0.75 HP (0.56 kW)[5]
Length—25 inches (635 mm)[5]
Width—20 inches (508 mm)[5]
Height—24 inches (610 mm)[5]
Estimated Shipping Weight—285 lbs (129.3 kg)[5]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]aggiefab.tamu.eduaggiefab.tamu.edu
  2. [2]disco.com.sgdisco.com.sg
  3. [3]disco.co.jpdisco.co.jp
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org