Waferpedia

Comparison ledger

IsoMet 1000 Precisionversus15

Buehler IsoMet 1000 Precision, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMBuehlerLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler IsoMet 1000 PrecisionLapmaster 15
Specifications
Blade Diameter Range4-7 inches [102-178mm][1]—
Arbor Size0.5 inch [12.7mm][1]—
Wheel Speed100-975 rpm[1]—
Motor Power1/8 HP (90W)[2]—
Voltage/Frequency85-264V, 50/60Hz[1]—
Weight56 lbs [25kg][1]—
Shipping Weight75 lbs [34kg][2]—
Dimensions (W x D x H)15.5 W x 21 D x 12 in H [394 x 533 x 305mm][1]—
Sound Rating70dB – no load[1]—
Control TypeMembrane touch-pad panel[1]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]documents.thermofisher.comdocuments.thermofisher.com
  2. [2]fab.cba.mit.edufab.cba.mit.edu
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org