Waferpedia

Comparison ledger

0010-18024 Pyrometer Assemblyversus2800

Applied Materials 0010-18024 Pyrometer Assembly, KLA 2800, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2800KLA
OEMApplied MaterialsKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-18024 Pyrometer AssemblyKLA 2800
Specifications
ConfigurationCapable of working on Applied Materials Radiance[1]SMAC board[2]
Inspection type—Broadband brightfield DUV/UV/VIS[5]
Wavelengths—Multiple wavelengths (DUV/UV/VIS)[5]
Design rule support—Sub-65-nm (extends to 45-nm and beyond)[5]
Throughput improvement—2X better than previous-generation DUV tool[5]
Optical modes—Array of optical modes for optimal sensitivity per layer/design/process[5]
Defect classification—Advanced binning and realtime defect classification[5]
Sensitivity and contrast—Maximum sensitivity and best material contrast for critical defects across all layers[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org