2800

The KLA 2800 is a patterned wafer inspection system. The KLA 2800 belongs to the 2800 Series broadband brightfield DUV/UV/VIS inspection platform. The 2800 Series is designed for sub-65-nm design rule development and production. The system provides multiple wavelengths for defect capture across process layers. The 2800 Series offers a 2X improvement in throughput compared to a previous-generation DUV inspection tool. The platform includes a roadmap that extends to 45-nm and beyond design rules.^[1]

The KLA 2800 uses broadband illumination spanning deep ultraviolet, ultraviolet, and visible wavelengths. The system includes an array of optical modes to provide optimal sensitivity for specific layers, designs, or process types. The tool captures images of patterned wafers and compares them against reference images to identify defects. Advanced binning and real-time defect classification accelerate defect review and yield learning.^[1]

The KLA 2800 is used for after-develop inspection and after-etch inspection of patterned wafers. The system supports Photo Cell Monitoring (PCM) to identify lithography-related micro defects before product wafer release. The tool performs Process Window Qualification (PWQ) to detect reticle design errors on phase shift masks. Micro After-Develop Inspection (ADI) on the KLA 2800 finds yield-limiting photo integration defects on production wafers.^[1]

The KLA 2800 is suited for the Photo Cell Monitoring (PCM) application, which uses optimized test wafers to quickly identify and eliminate lithography-related micro defects. The tool supports Process Window Qualification (PWQ), which employs an intelligent wafer layout inspection to identify reticle design errors on phase shift masks. The Micro After-Develop Inspection (mADI) application uses the color noise suppression and high sensitivity of the 2800 to find yield-limiting photo integration defects on production wafers.^[1]