Comparison ledger
Oxford Instruments 100 ICP Fluorine, SPTS CET25, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | CET25SPTS |
|---|---|---|
| OEM | Oxford Instruments | SPTS |
| Category | Etch | Etch |
| Wafer size | — | 25-wafer batch |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | SPTS CET25 |
| Cited variants | — | |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[3] | — |
| Cryo DRIE etch rate | up to 5 µm/min[3] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[3] | — |
| Process type | — | HF vapor release etch for MEMS[4] |
| Batch size | — | 25-wafer batch[4] |
| Target application | — | Medium to high volume production applications[4] |
| Key benefits | — | High throughput; process chamber, gas and liquid panel, and pressure control components within a small footprint; extensive process control and monitoring functions[4] |
| Configuration support | — | Various SPTS cluster configurations with the ability to support multiple process modules[4] |
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