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DAD 3350 Automatic Dicing alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
ADT
8020 Auto Twin Dicing
Dicing & Grinding
The ADT 8020 Auto Twin Dicing is a fully automatic twin dicing system for 8-inch workpieces.
Accretech
AD 3000 T Dicing
Dicing & Grinding
The Accretech AD 3000 T Dicing is a fully automatic dicing saw for 300 mm wafers.
Veeco
ADS 800 Dicing
Dicing & Grinding
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
Accretech
SS 20 Automatic Dicing
Dicing & Grinding
Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
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