Waferpedia

Comparison ledger

840versus15

Disco 840, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
840Disco
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 840Lapmaster 15
Cited variants—
Specifications
Wafer size range4–8 inch[1]—
Spindle speed1000–7000 rpm[1]—
Vertical stroke110 mm[1]—
Planarity accuracy within wafer0.0015 mm[1]—
Chuck table typePorous vacuum chuck[1]—
Grinding wheel diameter8 inch[1]—
Number of cassettes2[1]—
Number of spindles2 (independently adjustable)[1]—
Dimensions (W × D × H)1050 × 2150 × 1710 mm[1]—
Electrical supply200 V, 3 phase, 50/60 Hz[1]—
CDA supply0.5–0.8 MPa[1]—
DI water supply0.2–0.3 MPa, 15 l/min or higher[1]—
Oil mist filtration system (optional)Pure Boyd PBH 100[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]s3-alliance.coms3-alliance.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org