Comparison ledger
ASML Twinscan XT 1250 D, CEE 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | |
|---|---|---|
| OEM | ASML | CEE |
| Category | Lithography | Lithography |
| Wafer size | Continuous clampable wafer table for dry WSs: Absent | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML Twinscan XT 1250 | CEE 100 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | with Cymer XLA165[2] | — |
| Track Pre-warning signal (APR)s | APR enabled[2] | — |
| Active wafer release for dry WSs | FALSE[2] | — |
| Wafer size | Continuous clampable wafer table for dry WSs: Absent[2] | Up to 6 inches[3] |
| Wafer Stage Configurations | Wafer Stage type 2 configuration[2] | — |
| Wafer Carrier Locations | Right[2] | — |
| Wafers per Carriers | 25[2] | — |
| Wafer Mark Sensors | Absent[2] | — |
| Wafer Id Readers | Absent[2] | — |
| Wafer Tracks | Present[2] | — |
| Wafer Stage Types | Dual Chuck[2] | — |
| Wafer Stress Relaxations | FALSE[2] | — |
| Lower Docking Plates | Present[2] | — |
| WS Balance Masss | Stainless Steel[2] | — |
| WH Robot Power Amplifiers | CPM 20[2] | — |
| Light source | Cymer XLA165[2] | — |
| Wafer stage type | Dual Chuck[2] | — |
| Wafer configuration | Dry[2] | — |
| Carrier handler type | Mark I 300 Foup[2] | — |
| Wafer handling load & unload robot type | Double Fold Arm, 12 mm Z stroke[2] | — |
| Reticle stage measurement system on scans | Heidenhain Encoders[2] | — |
| Reticle stage chuck type | Glued Leafspring, TYPE_2: Glued LS, Pneum. GC, IFM / ENC[2] | — |
| Integrated reticle inspection system | PPD1 with IRIS1 functionality[2] | — |
| Reticle size | 6 inch[2] | — |
| Wafers per carrier | 25[2] | — |
| Wafer stage balance mass | Stainless Steel[2] | — |
| Interferometer axis version at exposures | 3 plus 1 axis[2] | — |
| Universal Prealignments | Disabled[2] | — |
| Wafer Handling Pneumaticss | Dedicated[2] | — |
| Tool type | — | Spray Developer[1] |
| Accepts wafer size | — | up to 6" wafers[3] |
| Programmable programs | — | 10 programs[3] |
| Steps per program | — | up to 10 steps[3] |
| Programmable step parameters | — | Acceleration, Speed, Time[3] |
| Associated document | — | CEE Model 100CB Spinner.doc[3] |
| Programs | — | 10 programs each with up to 10 steps[3] |
| Control parameters | — | Acceleration, Speed, Time[3] |
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