Waferpedia

Comparison ledger

0020 18455 PartversusPE 4400

Applied Materials 0020 18455 Part, Perkin Elmer PE 4400, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
PE 4400Perkin Elmer
OEMApplied MaterialsPerkin Elmer
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartPerkin Elmer PE 4400
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]Not operational[2]
Make—Perkin Elmer[2]
Model—PE 4400[2]
Equipment type—Sputtering System[2]
Category—Deposition[3]
Cathode shape—Circular[4]
Cathode size—8 inch[4]
Cathode port amount—1 to 4[4]
Cathode / sputter type—RF Magnetron[4]
DC power supply—1-5 KW[4]
RF power supply—1-2 KW[4]
Process gas—Argon (200 SCCM) standard[4]
Gas lines—Up to 3 gas lines, MFC customized[4]
Substrate size—Small to 6 inch[4]
Wafer load—Manually load, capable of limited automatic operation[4]
Throughput per batch—3 inch wafer, 30 pieces; 4 inch wafer, 13 pieces; 5 inch wafer, 9 pieces; 6 inch wafer, 7 pieces[4]
Sputter rate—20 to 500 Angstroms/kw-min depending on model, cathode, process, sputter material, etc.[4]
Uniformity capacity—±7%~10%[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]allwin21.comallwin21.com