Comparison ledger
ABM -407B-1-S-CES293 Robot, MPI TS 3000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TS 3000MPI | |
|---|---|---|
| OEM | ABM | MPI |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | MPI TS 3000 |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[3] | TS 3000[4] |
| Description | ROBOT[3] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[3] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[3] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[3] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[3] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[3] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[3] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[3] | — |
| Manufacturer | — | MPI[4] |
| System type | — | 300 mm automated probe system[1] |
| Applications | — | DC-IV, DC-CV, Pulsed-IV, RF, mmW, load-pull, IC Design Validation, Failure Analysis[1] |
| Chuck XY stage travel range | — | 310 mm x 335 mm[1] |
| Chuck XY stage resolution | — | 0.5 µm[1] |
| Chuck Z stage travel range | — | 30 mm[1] |
| Chuck Z stage resolution | — | 0.2 µm[1] |
| Wafer loading | — | 150 mm, 200 mm, or 300 mm wafers or substrates[1] |
| Probe card holder | — | 4.5 x 11 in[1] |
| Max. no. of micropositioners | — | 10x DC MicroPositioners or 4x DC + 4x HF MicroPositioner[1] |
| Temperature range | — | 20 °C to 300 °C[1] |
| Temperature range with IceFreeEnvironment | — | -60 °C to 300 °C[1] |
| Control software | — | SENTIO[1] |
| Chuck top material | — | Nickel plated aluminum[1] |
| Chuck surface | — | Planar with 0.5 mm diameter holes in centric sections[1] |
| Supported DUT sizes | — | Single DUTs down to 5x5 mm size or wafers 100 mm thru 300 mm[2] |
| Maximum voltage between chuck top and GND | — | 500 V DC[1] |