Zygo

The Zygo Z3D-7000 is a non-contacting, non-destructive optical metrology system designed for production wafers. The system accommodates 200 mm and 300 mm wafer sizes and can be configured as a bridge tool to handle both sizes simultaneously. Wafers are loaded via FOUPs and/or open cassettes. The Z3D-7000 incorporates Zygo's fifth-generation interferometric technology and is ISO Class 2, S2/S8, and CE certified with SEMI E95 compliant software. The system uses modular IntelliSensors to reduce mean time between repairs.[1][2]
The Z3D-7000 uses a high-precision stage and Zygo's 'OneShot' processing algorithms to simultaneously measure multiple parameters including film thickness, critical dimensions, overlay, trench depth, and general surface topography. The system's 'TopSlice' and 'FilmSlice' analysis capabilities isolate the top surface topography of multilayer films and can calculate film thickness maps. The long scan range and encoder technology on the z-axis enable measurement of wafer curvature for film stress tracking. The measurement data shows high correlation with contact techniques such as atomic force microscopes and stylus profilers.[1][2]
Process applications and technology nodes documented for this tool.
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The Z3D-7000 accommodates 200 mm and 300 mm wafers and can be configured as a bridge tool to handle both sizes simultaneously.[1][2]
The system uses MetroPro software, which provides a suite of measurement, control, data analysis, and processing options including 2D and 3D plots, reports, and statistics.[1][2]
The system is ISO Class 2, S2/S8, and CE certified, and its software is SEMI E95 compliant.[1][2]
The Z3D-7000 achieves throughput that exceeds contact technologies such as profilers or atomic force microscopes by as much as a factor of 10, while maintaining high correlation with those measurement techniques.[1]
The following facts about the Z3D-7000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Z3D-7000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Z3D-7000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Z3D-7000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Z3D-7000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Z3D-7000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 5, 2026.
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