YES
R3A
Plate 01Voigtlander Bessa R3A (Removing and attaching the lens)
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How it works
The YES R3A operates at a low frequency of 40 kHz with a power of 500 W. The system can be configured for Active Plasma mode for routine cleaning, RIE mode for more aggressive etching, and Downstream mode which removes charged species from the plasma stream to allow electron-free cleaning of electrostatic discharge sensitive components. The chamber is configured with two shelves that can hold multiple trays or wafers at once.[2]
Applications
The YES R3A is applied to contamination removal prior to wire bonding, surface activation for adhesion improvement, and photoresist stripping, though the latter is not its primary use in some facilities. Other applications include removal of oil films or metal oxides, and surface modification of materials for bonding, such as polyethylene to stainless steel or gold deposition to quartz.[1][2]
- plasma cleaning
- surface modification
What do the numbers mean?
Power & electrical1
Gas & chemistry1
- Primary Application
- Surface treatment including photoresist stripping (not primary use in Protofab)[2]
Configuration & options11
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What are the sample tray dimensions and total capacity of the YES R3A?
The YES R3A has two 14 by 14 inch sample trays for a total capacity of 390 square inches.[1]
What operational modes does the YES R3A support?
The YES R3A supports three operational modes: Active Plasma, RIE, and Downstream.[2]
What is the power and frequency of the YES R3A system?
The YES R3A is a 500 W low-frequency system controlled by a 40 kHz Advanced Energy PE-1000 AC source.[2]
Who originally developed the YES R3A?
The YES R3A was originally developed by Glen Technologies before Yield Engineering Systems acquired the company in 1998.[1]
What is the primary application of the YES R3A in assembly processes?
The primary application is contamination removal from surfaces and pads prior to assembly or wire bonding.[2]
Not publicly documented
The following facts about the R3A are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the R3A are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the R3A are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the R3A are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the R3A are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the R3A is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]protowiki.oasis.ucsb.edu — protowiki.oasis.ucsb.eduprotowiki.oasis.ucsb.edu
Last updated Sep 22, 2026.
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