Waferpedia

Yamaha

YS 12

Assembly / SMTYamaha YS 12 family
Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Yamaha YS 12 is a Pick and Place system. The Yamaha YS 12 dates from 2013.[1]

YS 12 — Inventory photo
Fig. 01YS 12Inventory photo[1]

What it is

The Yamaha YS 12 is a Pick and Place system categorized under Assembly / SMT. The machine dates from 2013.[1][2]

How it works

General reference — not yet source-verified

Pick and place machines use a moving head or gantry to retrieve components from feeder tapes or trays and place them at programmed coordinates on the PCB. A vision system aligns the component leads or pads with the board pattern before placement.

Multiple placement heads can operate in parallel to increase throughput. The machine can handle a range of component sizes and types, from small passive devices to larger integrated circuits.

Where it fits in the process flow

General reference — not yet source-verified

In an SMT assembly line, the pick and place machine follows a solder paste printer that deposits paste on the PCB pads. After component placement, the board passes to a reflow oven where the solder paste is melted to form permanent electrical and mechanical connections.

What do the numbers mean?

Configuration & options5

Manufacturer
Yamaha[2]
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Model
YS 12[1]
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Equipment type
Pick and Place[1]
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Category
Assembly / SMT[2]
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Vintage
2013[1]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of machine is the Yamaha YS 12?

The Yamaha YS 12 is a Pick and Place system.[1][2]

Not publicly documented

The following facts about the YS 12 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the YS 12 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the YS 12 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the YS 12 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the YS 12 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the YS 12 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 8, 2026.

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