Waferpedia

Tokyo Electron

Telius SCCM Oxide

EtchTokyo Electron Telius SCCM Oxide family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

General reference — not yet source-verified

The Tokyo Electron Telius SCCM Oxide is an etch tool.

How it works

General reference — not yet source-verified

An oxide etcher removes selected oxide material by exposing a wafer to a controlled plasma etch environment.

Etch tools in this class are used to transfer patterned openings from a mask into the target film layer.

Where it fits in the process flow

General reference — not yet source-verified

The Telius SCCM Oxide fits into semiconductor fabrication at the pattern-transfer stage after masking and before later completion steps that follow film removal.

Applications

General reference — not yet source-verified

The Telius SCCM Oxide is intended for oxide etch applications in semiconductor manufacturing.

The Telius SCCM Oxide is part of an oxide-etch tool family used for removing oxide films from wafers.

What do the numbers mean?

Wafer handling1

Wafer size
12 inch[2]
Accurate?

Gas & chemistry1

Model
Telius SCCM[2]
Accurate?

Configuration & options3

Vintage
2004[1]
Accurate?
OEM
Tokyo Electron[2]
Accurate?
Category
Etch[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ModelTelius SCCM[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the Telius SCCM Oxide are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Telius SCCM Oxide are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Telius SCCM Oxide are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Telius SCCM Oxide are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Telius SCCM Oxide are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Telius SCCM Oxide is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
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Last updated Oct 7, 2026.

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